The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_height: 0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, special_features: RF INPUT POWER 100 MW MAX, features_provided: HERMETICALLY SEALED AND HYBRID, inclosure_material: METAL, storage_temp_range: -65.0 TO 200.0 CELSIUS DEGC, operating_temp_range: -25.0 TO 125.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System under NSN 5962-01-203-3390, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_height | 0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| special_features | RF INPUT POWER 100 MW MAX |
| features_provided | HERMETICALLY SEALED AND HYBRID |
| inclosure_material | METAL |
| storage_temp_range | -65.0 TO 200.0 CELSIUS DEGC |
| operating_temp_range | -25.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| input_circuit_pattern | 1 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| design_function_and_quantity | 1 AMPLIFIER, GENERAL PURPOSE |
| case_outline_source_and_designator | -TO-39 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| NSN | 5962-01-203-3390 |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, GENERAL PURPOSE |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS NOMINAL POWER SOURCE |
| STORAGE TEMP RANGE | -65.0 TO 200.0 CELSIUS DEGC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| FEATURES PROVIDED | HERMETICALLY SEALED AND HYBRID |
| SPECIAL FEATURES | RF INPUT POWER 100 MW MAX |
| BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | CAN |
| BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| CASE OUTLINE SOURCE AND DESIGNATOR | -TO-39 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |