A Sandberg Design Cover effectively protects your phone against marks and scratches while also giving it a more personal look. Key specifications include material: STEEL OVERALL, hole_type: DRILLED, head_style: FLAT CHAMFER, head_height: 0.190 INCHES NOMINAL IN, thread_class: 2A A, head_diameter: 0.312 INCHES NOMINAL IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-163-3854, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | STEEL OVERALL |
| hole_type | DRILLED |
| head_style | FLAT CHAMFER |
| head_height | 0.190 INCHES NOMINAL IN |
| thread_class | 2A A |
| head_diameter | 0.312 INCHES NOMINAL IN |
| hole_diameter | 0.046 INCHES NOMINAL IN |
| hole_quantity | 2 |
| thread_length | 0.625 INCHES MAXIMUM IN |
| overall_length | 0.250 INCHES NOMINAL IN |
| fastener_length | 0.625 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| NSN | 5961-00-163-3854 |
| ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | COLLECTOR |
| POWER RATING PER CHARACTERISTIC | 5.0 WATTS MAXIMUM COLLECTOR POWER DISSIPATION |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS JUNCTION DEGC |
| INTERNAL JUNCTION CONFIGURATION | PNP |
| MOUNTING METHOD | TERMINAL |
| SEMICONDUCTOR MATERIAL | SILICON |
| OVERALL DIAMETER | 0.370 INCHES NOMINAL IN |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |