The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND MONOLITHIC AND PROGRAMMABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-176-5716, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| body_height | 0.210 INCHES MAXIMUM IN |
| body_length | 1.290 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND MONOLITHIC AND PROGRAMMABLE |
| output_logic_form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 14 INPUT |
| end_item_identification | RADAR DATA TRANSFER,SUBSYSTEM AN/GPN-22(V) |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-176-5716 |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| MEMORY DEVICE TYPE | PROM |
| BODY LENGTH | 1.290 INCHES MAXIMUM IN |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
| TEST DATA DOCUMENT | 14933-80012 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |