4014666-855 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

4014666-855: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.890 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND LOW POWER AND PROGRAMMED AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-176-1577, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

4014666-855

NSN: 5962-01-176-1577
FSC: 5962 — Microcircuits, Electronic
CAGE: 1PQF4 — CAE USA INC. (USA)

SPECIFICATIONS

body_width	0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length	0.890 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND LOW POWER AND PROGRAMMED AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 150.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-176-1577

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND LOW POWER AND PROGRAMMED AND BIPOLAR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND LOW POWER AND PROGRAMMED AND BIPOLAR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.890 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

N82S185Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 4014666-855?

4014666-855 is a MICROCIRCUIT,MEMORY.

What parts can replace 4014666-855?

There are 2 known substitutes for 4014666-855: ROM/PROM, N82S185. Substitute compatibility should be verified for your specific system.

What is the NSN for 4014666-855?

4014666-855 is cataloged in the U.S. Government catalog under NSN 5962-01-176-1577. This indicates validated use in U.S. government and defense supply chains.

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4014666-855 — MICROCIRCUIT,MEMORY

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