4014666-412 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

4014666-412: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.160 INCHES MAXIMUM IN, body_length: 0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-116-1002, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

4014666-412

NSN: 5962-01-116-1002
FSC: 5962 — Microcircuits, Electronic
CAGE: 1PQF4 — CAE USA INC. (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.160 INCHES MAXIMUM IN
body_length	0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-116-1002

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.160 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

•

BODY LENGTH: 0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.160 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

N82S185-FReference document

Same NSN cross-reference

Reference document — Secondary reference

4014397-01Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 4014666-412?

4014666-412 is a MICROCIRCUIT,MEMORY.

What parts can replace 4014666-412?

There are 2 known substitutes for 4014666-412: N82S185-F, 4014397-01. Substitute compatibility should be verified for your specific system.

What is the NSN for 4014666-412?

4014666-412 is cataloged in the U.S. Government catalog under NSN 5962-01-116-1002. This indicates validated use in U.S. government and defense supply chains.

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