401-6900461: SEMICONDUCTOR DEVICE ASSEMBLY.
The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 4.000 INCHES NOMINAL IN, overall_length: 4.250 INCHES NOMINAL IN, mounting_configuration: FOUR 0.172 IN MIN TO 0.182 IN MAX DIA MTG HOLES SPACED 0.250 IN BY 0.357 IN MTG CENTERS IN. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-433-1140, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 4.000 INCHES NOMINAL IN |
| overall_length | 4.250 INCHES NOMINAL IN |
| mounting_configuration | FOUR 0.172 IN MIN TO 0.182 IN MAX DIA MTG HOLES SPACED 0.250 IN BY 0.357 IN MTG CENTERS IN |
| NSN | 5961-01-433-1140 |
| MAJOR COMPONENTS | PRINTED WIRING BOARD 1; SEMICONDUCTOR, DIODE 10; TERMINAL STRIP 2 |
| OVERALL LENGTH | 4.250 INCHES NOMINAL IN |
| OVERALL WIDTH | 4.000 INCHES NOMINAL IN |
| MOUNTING CONFIGURATION | FOUR 0.172 IN MIN TO 0.182 IN MAX DIA MTG HOLES SPACED 0.250 IN BY 0.357 IN MTG CENTERS IN |