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401-6900461 — SEMICONDUCTOR DEVICE ASSEMBLY

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

401-6900461: SEMICONDUCTOR DEVICE ASSEMBLY.

The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 4.000 INCHES NOMINAL IN, overall_length: 4.250 INCHES NOMINAL IN, mounting_configuration: FOUR 0.172 IN MIN TO 0.182 IN MAX DIA MTG HOLES SPACED 0.250 IN BY 0.357 IN MTG CENTERS IN. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-433-1140, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
401-6900461
NSN: 5961-01-433-1140
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 53711 — NAVAL SEA SYSTEMS COMMAND (USA)
SPECIFICATIONS
overall_width4.000 INCHES NOMINAL IN
overall_length4.250 INCHES NOMINAL IN
mounting_configurationFOUR 0.172 IN MIN TO 0.182 IN MAX DIA MTG HOLES SPACED 0.250 IN BY 0.357 IN MTG CENTERS IN
NSN5961-01-433-1140
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN 401-6900461 MFR OEM SEMICONDUCTOR DEVICE ASSEMBLY
KEY FEATURES
•
MAJOR COMPONENTS: PRINTED WIRING BOARD 1; SEMICONDUCTOR, DIODE 10; TERMINAL STRIP 2
•
MOUNTING CONFIGURATION: FOUR 0.172 IN MIN TO 0.182 IN MAX DIA MTG HOLES SPACED 0.250 IN BY 0.357 IN MTG CENTERS IN
TECHNICAL CHARACTERISTICS
MAJOR COMPONENTSPRINTED WIRING BOARD 1; SEMICONDUCTOR, DIODE 10; TERMINAL STRIP 2
OVERALL LENGTH4.250 INCHES NOMINAL IN
OVERALL WIDTH4.000 INCHES NOMINAL IN
MOUNTING CONFIGURATIONFOUR 0.172 IN MIN TO 0.182 IN MAX DIA MTG HOLES SPACED 0.250 IN BY 0.357 IN MTG CENTERS IN
OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978
SUBSTITUTES & CROSS-REFERENCES 2
401-6899812 ITEM 12Reference document
Same NSN cross-reference
Reference document — Secondary reference
401-6899808 ITEM 30Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 401-6900461?
401-6900461 is a SEMICONDUCTOR DEVICE ASSEMBLY.
What parts can replace 401-6900461?
There are 2 known substitutes for 401-6900461: 401-6899812 ITEM 12, 401-6899808 ITEM 30. Substitute compatibility should be verified for your specific system.
What is the NSN for 401-6900461?
401-6900461 is cataloged in the U.S. Government catalog under NSN 5961-01-433-1140. This indicates validated use in U.S. government and defense supply chains.
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