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400902-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

400902-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include inclosure_material: CERAMIC, memory_device_type: PAL, operating_temp_range: +0.0 TO 75.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE, terminal_surface_treatment: SOLDER, time_rating_per_chacteristic: 25.00 NANOSECONDS MAXIMUM DELAY NS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-412-0243, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
400902-1
NSN: 5962-01-412-0243
FSC: 5962 — Microcircuits, Electronic
CAGE: 34280 — WAVETEK RF PRODUCTS, INC (USA)
SPECIFICATIONS
inclosure_materialCERAMIC
memory_device_typePAL
operating_temp_range+0.0 TO 75.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
time_rating_per_chacteristic25.00 NANOSECONDS MAXIMUM DELAY NS
part_name_assigned_by_controlling_agencyPROGRAMMED CONTROL PAL
voltage_rating_and_type_per_characteristic5.0 VOLTS NOMINAL POWER SOURCE
NSN5962-01-412-0243
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 400902-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PAL
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS NOMINAL POWER SOURCE
•
OPERATING TEMP RANGE: +0.0 TO 75.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPAL
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.0 VOLTS NOMINAL POWER SOURCE
OPERATING TEMP RANGE+0.0 TO 75.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCYPROGRAMMED CONTROL PAL
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC25.00 NANOSECONDS MAXIMUM DELAY NS
SUBSTITUTES & CROSS-REFERENCES 3
280179Reference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
GAL16V8-25QNCReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 400902-1?
400902-1 is a MICROCIRCUIT,MEMORY.
What parts can replace 400902-1?
There are 3 known substitutes for 400902-1: 280179, ROM/PROM, GAL16V8-25QNC. Substitute compatibility should be verified for your specific system.
What is the NSN for 400902-1?
400902-1 is cataloged in the U.S. Government catalog under NSN 5962-01-412-0243. This indicates validated use in U.S. government and defense supply chains.
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