The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: HERMETICALLY SEALED AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PROM, operating_temp_range: +0.0 TO 70.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE, terminal_surface_treatment: SOLDER. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-308-7810, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | HERMETICALLY SEALED AND PROGRAMMED |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 24 PRINTED CIRCUIT |
| time_rating_per_chacteristic | 450.00 NANOSECONDS MAXIMUM DELAY NS |
| voltage_rating_and_type_per_characteristic | 6.0 VOLTS MAXIMUM POWER SOURCE |
| NSN | 5962-01-308-7810 |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS DEGC |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| MEMORY DEVICE TYPE | PROM |
| TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM DELAY NS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE MATERIAL | CERAMIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMED |