The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.280 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, overall_width: 0.310 INCHES MAXIMUM IN, overall_height: 0.325 INCHES NOMINAL IN, overall_length: 0.785 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-003-0366, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.280 INCHES MAXIMUM IN |
| body_height | 0.180 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| overall_width | 0.310 INCHES MAXIMUM IN |
| overall_height | 0.325 INCHES NOMINAL IN |
| overall_length | 0.785 INCHES MAXIMUM IN |
| features_provided | BURN IN AND W/CLEAR AND W/CLOCK |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 8 INPUT |
| NSN | 5962-01-003-0366 |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| BODY HEIGHT | 0.180 INCHES MAXIMUM IN |
| INPUT CIRCUIT PATTERN | 8 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| FEATURES PROVIDED | BURN IN AND W/CLEAR AND W/CLOCK |
| BODY WIDTH | 0.280 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP, J-K, MASTER SLAVE |
| OVERALL WIDTH | 0.310 INCHES MAXIMUM IN |