391-0353-153: SEMICONDUCTOR DEVICE SET.
The SEMICONDUCTOR DEVICE SET is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE, overall_length: 0.205 INCHES MINIMUM AND 0.225 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN, mounting_method: PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE, overall_diameter: 0.119 INCHES MINIMUM AND 0.124 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN, semiconductor_material: SILICON ALL SEMICONDUCTOR DEVICE DIODE, end_item_identification: JTIDS. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-419-4623, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE |
| overall_length | 0.205 INCHES MINIMUM AND 0.225 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| mounting_method | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
| overall_diameter | 0.119 INCHES MINIMUM AND 0.124 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| semiconductor_material | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| end_item_identification | JTIDS |
| terminal_type_and_quantity | 2 CASE ALL SEMICONDUCTOR DEVICE DIODE |
| component_name_and_quantity | 4 SEMICONDUCTOR DEVICE DIODE |
| specification/standard_data | 13499-353-3793 MANUFACTURERS SPECIFICATION |
| component_function_relationship | MATCHED |
| voltage_rating_in_volts_per_characteristic | 35.0 MINIMUM BREAKDOWN VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE |
| maximum_operating_temp_per_measurement_point | 150.0 CELSIUS JUNCTION ALL SEMICONDUCTOR DEVICE DIODE DEGC |
| NSN | 5961-01-419-4623 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 35.0 MINIMUM BREAKDOWN VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS JUNCTION ALL SEMICONDUCTOR DEVICE DIODE DEGC |
| OVERALL DIAMETER | 0.119 INCHES MINIMUM AND 0.124 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| COMPONENT FUNCTION RELATIONSHIP | MATCHED |
| MOUNTING METHOD | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
| SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| OVERALL LENGTH | 0.205 INCHES MINIMUM AND 0.225 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| COMPONENT NAME AND QUANTITY | 4 SEMICONDUCTOR DEVICE DIODE |
| SPECIFICATION/STANDARD DATA | 13499-353-3793 MANUFACTURERS SPECIFICATION |
| TEST DATA DOCUMENT | 13499-952-6557-001 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL", "AVERAGE", "NOMINAL", ETC.). |