The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, overall_width: 0.170 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN, overall_height: 0.130 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN, overall_length: 0.175 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 0.500 INCHES MINIMUM IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-082-8970, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC ENCLOSURE |
| overall_width | 0.170 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN |
| overall_height | 0.130 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN |
| overall_length | 0.175 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 0.500 INCHES MINIMUM IN |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 500.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| current_rating_per_characteristic | 20.00 MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT |
| voltage_rating_in_volts_per_characteristic | 7.5 MAXIMUM NOMINAL REGULATOR VOLTAGE |
| maximum_operating_temp_per_measurement_point | 150.0 CELSIUS CASE DEGC |
| NSN | 5961-01-082-8970 |
| TERMINAL LENGTH | 0.500 INCHES MINIMUM IN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS CASE DEGC |
| CURRENT RATING PER CHARACTERISTIC | 20.00 MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT |
| POWER RATING PER CHARACTERISTIC | 500.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| OVERALL LENGTH | 0.175 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 7.5 MAXIMUM NOMINAL REGULATOR VOLTAGE |
| OVERALL HEIGHT | 0.130 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN |
| MOUNTING METHOD | TERMINAL |
| OVERALL WIDTH | 0.170 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN |
| MATERIAL | SILICON SEMICONDUCTOR |