382265-1: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, end_item_identification: ARC-164 APACH. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-476-4889, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | ELECTROSTATIC SENSITIVE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | PLASTIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | ARC-164 APACH |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 160 LEADLESS |
| design_function_and_quantity | 1 ARRAY |
| case_outline_source_and_designator | MO-108-DD1 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| part_name_assigned_by_controlling_agency | MICROCIRCUIT, DIGITAL-CMOS, FIELD PROGRAMMABLE GATE ARRAY |
| NSN | 5962-01-476-4889 |
| INCLOSURE MATERIAL | PLASTIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 ARRAY |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CASE OUTLINE SOURCE AND DESIGNATOR | MO-108-DD1 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |