The Bonding Machine,ultrasonic,wire, cataloged under National Stock Number 3670-01-308-3702, is classified within Federal Supply Class 3670 (Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery) of the Special Industry Machinery group. Current acquisition status: Active.
This page shows the U.S. Government catalog record for NSN 3670-01-308-3702 as we hold it. The record gives the stock number, the item name (Bonding Machine,ultrasonic,wire), its supply class (FSC 3670, Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery) and its status (active). It lists no specifications, no manufacturer and no manufacturer part numbers. We show what the record contains and nothing more. If you know this part by a manufacturer's part number, search for that number instead.
| Item Name | Bonding Machine,ultrasonic,wire |
| FSC / FSG | 3670 — Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery (FSG 36) |
| Parameter | Value |
|---|---|
| NSN | 3670-01-308-3702 |
| Item Name | Bonding Machine,ultrasonic,wire |
| FSC / FSG | 3670 / 36 — Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery |
| Status | ACTIVE |
| Acquisition Status | ACTIVE |
| DEMIL Code | DEMIL Q — CCL Item — Commerce Control List |
| Hazard | No hazard code in the DLA record (HMIC N) |
| Criticality Code | X |
NSN 3670-01-308-3702 is a Bonding Machine,ultrasonic,wire, classified under FSC 3670, Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery. Status: active.
No hazard code in the DLA record (HMIC N). Hazard information on this page is shown exactly as it appears in the DLA record.
NSN 3670-01-308-3702 has DEMIL Code Q. Demilitarization may be required before disposal or transfer to non-military entities.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-16.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.