PartsTable TECHNICAL DATA SHEET
NSN 3670-01-255-3269Government record, cited

Laminating Machine, Printed Circu3670-01-255-3269

NSN 3670-01-255-3269 · NIIN 012553269
FSC 3670 — Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery · FSG 36 — Special Industry Machinery
Government record, cited
Also searched as  3670-01-255-3269 · 3670012553269 · NIIN 012553269 · 01-255-3269 · FSC 3670 Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery · MINI-BONDER · 3620-1112-0103
Nearby stock numbers  ·
Features
  • Laminating Machine,printed Circu — FSC 3670
  • General Characteristics Item Description: OPERATES UNDER CONTROL TEMPERATURES OF UP TO 700 DEG F AND PRESSURES UP TO 300 PSIG FOR COMPOSITE BONDING,GLASS LAMINATING AND RUBBER CURING; VESSEL WORKSPACE 13.000 IN. SQ BY 36.000 IN. L; 2 DOOR ASSEMBLIES; HORIZONTAL LOADING; VESSEL SHELL I.D. 22.600 IN.; NITROGEN OR AIR PRESSURIZING MEDIUM IN
Identification
  • NSN: 3670-01-255-3269
  • NIIN: 012553269
  • FSC: 3670 — Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery
  • FSG: 36 — Special Industry Machinery
General Description

The Laminating Machine,printed Circu, cataloged under National Stock Number 3670-01-255-3269, is classified within Federal Supply Class 3670 (Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery) of the Special Industry Machinery group. Government technical data includes 1 specification, cited from the U.S. Government catalog. 2 additional reference documents (drawings, advisory and superseded references) are recorded in the U.S. Government catalog. Current acquisition status: Active.

Technical Specifications
ParameterValue
NSN3670-01-255-3269
Item NameLaminating Machine,printed Circu
FSC / FSG3670 / 36 — Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery
StatusACTIVE
General Characteristics Item DescriptionOPERATES UNDER CONTROL TEMPERATURES OF UP TO 700 DEG F AND PRESSURES UP TO 300 PSIG FOR COMPOSITE BONDING,GLASS LAMINATING AND RUBBER CURING; VESSEL WORKSPACE 13.000 IN. SQ BY 36.000 IN. L; 2 DOOR ASSEMBLIES; HORIZONTAL LOADING; VESSEL SHELL I.D. 22.600 IN.; NITROGEN OR AIR PRESSURIZING MEDIUM IN
Lifecycle & Compliance
Acquisition StatusACTIVE
DEMIL CodeDEMIL A — No Demilitarization Required
HazardNo hazard code in the DLA record (HMIC N)
Criticality CodeX
Cross-Reference Index
No manufacturer part numbers on file in the U.S. Government catalog.
Reference documents
ReferenceMeaning
MINI-BONDER 3/2 Design control — primary reference
U.S. Government activity
3620-1112-0103 6/9 Informative reference only
U.S. Government activity
No interchangeability data on file.
Other items in FSC 3670 — Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
3670-00-003-4557
3670-00-003-4557 · Item name not on file
3670-00-003-4558
3670-00-003-4558 · Item name not on file
3670-00-101-0060
3670-00-101-0060 · Item name not on file
3670-00-153-3827
3670-00-153-3827 · Item name not on file
3670-00-157-7975
3670-00-157-7975 · Item name not on file
3670-00-173-9403
3670-00-173-9403 · Item name not on file
3670-00-202-5014
3670-00-202-5014 · Item name not on file
3670-00-205-8813
3670-00-205-8813 · Item name not on file

Frequently Asked Questions

What is NSN 3670-01-255-3269?

NSN 3670-01-255-3269 is a Laminating Machine,printed Circu, classified under FSC 3670, Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery. Status: active.

What are the specifications of 3670-01-255-3269?

Key specifications for 3670-01-255-3269: General Characteristics Item Description: OPERATES UNDER CONTROL TEMPERATURES OF UP TO 700 DEG F AND PRESSURES UP TO 300 PSIG FOR COMPOSITE BONDING,GLASS LAMINATING AND RUBBER CURING; VESSEL WORKSPACE 13.000 IN. SQ BY 36.000 IN. L; 2 DOOR ASSEMBLIES; HORIZONTAL LOADING; VESSEL SHELL I.D. 22.600 IN.; NITROGEN OR AIR PRESSURIZING MEDIUM IN; Part Name Assigned by Controlling Agency: BONDER AUTOCLAVE SYSTEM. 1 specification is documented in the U.S. Government catalog.

Is NSN 3670-01-255-3269 hazardous material?

No hazard code in the DLA record (HMIC N). Hazard information on this page is shown exactly as it appears in the DLA record.

Sources

U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-16.

U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.

✓ Data cited from the U.S. Government catalog; commercial cross-references from OEM and certified industry sources.
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