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Technical Data Sheet
357009 ✓ Verified by PartsTable
· MRO · MRO_GENERAL
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, body_style: CLIP CONNECTED TYPE, body_material: METAL, overall_width: 1.625 INCHES NOMINAL IN, base_thickness: 0.188 INCHES NOMINAL IN, coating_method: PLATED CONTACT. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5920-00-284-6797, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
MRO MRO_GENERAL 357009
NSN: 5920-00-284-6797
FSC: 5920
CAGE: 75915 — LITTELFUSE, INC. (USA)
SPECIFICATIONS
materialSILICON SEMICONDUCTOR
body_styleCLIP CONNECTED TYPE
body_materialMETAL
overall_width1.625 INCHES NOMINAL IN
base_thickness0.188 INCHES NOMINAL IN
coating_methodPLATED CONTACT
inclosure_typeHERMETICALLY SEALED
overall_height0.656 INCHES NOMINAL IN
overall_length0.570 INCHES MAXIMUM IN
mounting_methodTERMINAL
terminal_length1.000 INCHES MINIMUM AND 1.625 INCHES MAXIMUM IN
overall_diameter0.215 INCHES MINIMUM AND 0.235 INCHES MAXIMUM IN
NSN5920-00-284-6797
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available SEMICONDUCTOR DEVICE,DIODE TITLE COMPONENT PN 357009 MFR SEMICONDUCTOR DEVICE,D
KEY FEATURES
COATING METHOD: PLATED CONTACT
BASE THICKNESS: 0.188 INCHES NOMINAL IN
FUSE ACCOMMODATION QUANTITY: 9
MOUNTING HOLE DIAMETER: 0.142 INCHES MINIMUM AND 0.147 INCHES MAXIMUM IN
BODY STYLE: CLIP CONNECTED TYPE
MOUNTING HOLE QUANTITY: 6
TECHNICAL CHARACTERISTICS (FLIS)
COATING METHODPLATED CONTACT
OVERALL HEIGHT0.656 INCHES NOMINAL IN
BASE THICKNESS0.188 INCHES NOMINAL IN
FUSE ACCOMMODATION QUANTITY9
OVERALL LENGTH5.500 INCHES NOMINAL IN
MOUNTING HOLE DIAMETER0.142 INCHES MINIMUM AND 0.147 INCHES MAXIMUM IN
BODY STYLECLIP CONNECTED TYPE
MOUNTING HOLE QUANTITY6
OVERALL WIDTH1.625 INCHES NOMINAL IN
MOUNTING HOLE STYLEIN-LINE ALONG THE LENGTH
VERIFIED SUBSTITUTES & CROSS-REFERENCES 13
13AF10B3541A1PC48Interchangeable
interchangeable cross-reference
interchangeable
X207284PC66Interchangeable
interchangeable cross-reference
interchangeable
13AF10B3541PPC48Interchangeable
interchangeable cross-reference
interchangeable
7744466P9Interchangeable
interchangeable cross-reference
interchangeable
35700-9Interchangeable
interchangeable cross-reference
interchangeable
1N5665AInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99Not HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 357009?
357009 is a SEMICONDUCTOR DEVICE,DIODE. It is classified as a MRO (MRO_GENERAL).
What parts can replace 357009?
There are 13 known substitutes for 357009: 13AF10B3541A1PC48, X207284PC66, 13AF10B3541PPC48 and 10 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 357009?
357009 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5920-00-284-6797. This indicates validated use in U.S. government and defense supply chains.
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