The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 1.453 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), overall_diameter: 0.667 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.250 INCHES IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-777-3191, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 1.453 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| overall_diameter | 0.667 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.250 INCHES IN |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| terminal_type_and_quantity | 2 TAB, SOLDER LUG |
| current_rating_per_characteristic | 1.40 AMPERES NOMINAL FORWARD CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 100.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE |
| maximum_operating_temp_per_measurement_point | 150.0 CELSIUS JUNCTION DEGC |
| NSN | 5961-00-777-3191 |
| MOUNTING METHOD | THREADED STUD(S) |
| TERMINAL TYPE AND QUANTITY | 2 TAB, SOLDER LUG |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL LENGTH | 1.453 INCHES MAXIMUM IN |
| CURRENT RATING PER CHARACTERISTIC | 1.40 AMPERES NOMINAL FORWARD CURRENT, DC |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS JUNCTION DEGC |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE |
| NOMINAL THREAD SIZE | 0.250 INCHES IN |
| OVERALL DIAMETER | 0.667 INCHES MAXIMUM IN |
| MOUNTING FACILITY QUANTITY | 1 |