The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.175 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.075 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-116-8969, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.175 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.075 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| current_rating_per_characteristic | 10.00 MILLIAMPERES MAXIMUM REVERSE CURRENT, PEAK |
| NSN | 5961-00-116-8969 |
| CURRENT RATING PER CHARACTERISTIC | 10.00 MILLIAMPERES MAXIMUM REVERSE CURRENT, PEAK |
| OVERALL DIAMETER | 0.075 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MOUNTING METHOD | TERMINAL |
| OVERALL LENGTH | 0.175 INCHES MAXIMUM IN |
| MATERIAL | GLASS ENCLOSURE |
| MATERIAL | SILICON SEMICONDUCTOR |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |