The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.155 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.075 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-130-3987, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.155 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.075 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| end_item_identification | MULTI-HULL |
| terminal_type_and_quantity | 2 PIN |
| power_rating_per_characteristic | 500.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| maximum_operating_temp_per_measurement_point | 200.0 CELSIUS AMBIENT AIR DEGC |
| joint_electronic_device_engineering_council/jedec/case_outline_designation | DO-35 |
| NSN | 5961-01-130-3987 |
| MATERIAL | SILICON SEMICONDUCTOR |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL LENGTH | 0.155 INCHES MAXIMUM IN |
| TERMINAL TYPE AND QUANTITY | 2 PIN |
| MOUNTING METHOD | TERMINAL |
| POWER RATING PER CHARACTERISTIC | 500.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| OVERALL DIAMETER | 0.075 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM IN |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-35 |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS AMBIENT AIR DEGC |