The TRANSISTOR is a the manufacturer industrial component. Key specifications include overall_length: 0.250 INCHES MINIMUM AND 0.340 INCHES MAXIMUM IN, mounting_method: UNTHREADED HOLE(S), overall_diameter: 0.620 INCHES MAXIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: PNP, features_provided: HERMETICALLY SEALED CASE, internal_configuration: JUNCTION CONTACT. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-416-4897, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| overall_length | 0.250 INCHES MINIMUM AND 0.340 INCHES MAXIMUM IN |
| mounting_method | UNTHREADED HOLE(S) |
| overall_diameter | 0.620 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: PNP |
| features_provided | HERMETICALLY SEALED CASE |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| mounting_facility_quantity | 2 |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD AND 1 CASE |
| specification/standard_data | 81349-MIL-S-19500/441 GOVERNMENT SPECIFICATION |
| power_rating_per_characteristic | 25.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
| current_rating_per_characteristic | 2.00 AMPERES MAXIMUM BASE CURRENT, DC AND -4.00 AMPERES MAXIMUM COLLECTOR CURRENT, DC |
| NSN | 5961-00-416-4897 |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| POWER RATING PER CHARACTERISTIC | 25.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNP |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | COLLECTOR |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | -60.0 MAXIMUM COLLECTOR TO BASE VOLTAGE/STATIC/EMITTER OPEN AND -60.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN AND -7.0 MAXIMUM EMITTER TO BASE VOLTAGE, STATIC, COLLECTOR OPEN |
| OVERALL DIAMETER | 0.620 INCHES MAXIMUM IN |
| SEMICONDUCTOR MATERIAL | SILICON |
| MOUNTING METHOD | UNTHREADED HOLE(S) |
| MOUNTING FACILITY QUANTITY | 2 |