351-8667-052: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.645 INCHES MAXIMUM IN, body_height: 0.087 INCHES MAXIMUM IN, body_length: 1.100 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND W/CLOCK, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND METAL. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-128-3918, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.645 INCHES MAXIMUM IN |
| body_height | 0.087 INCHES MAXIMUM IN |
| body_length | 1.100 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND W/CLOCK |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 100.0 CELSIUS DEGC |
| input_circuit_pattern | 18 INPUT |
| end_item_identification | DATA LINK 76301 |
| inclosure_configuration | FLAT PACK |
| maximum_power_dissipation_rating | 200.0 MILLIWATTS |
| NSN | 5962-01-128-3918 |
| INPUT CIRCUIT PATTERN | 18 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND METAL |
| BODY WIDTH | 0.645 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.087 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND W/CLOCK |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 1.100 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| OPERATING TEMP RANGE | -55.0 TO 100.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.