351-8642-012: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.345 INCHES MINIMUM AND 0.360 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.075 INCHES MAXIMUM IN, body_length: 0.345 INCHES MINIMUM AND 0.360 INCHES MAXIMUM IN, bit_quantity: 1024, word_quantity: 256, features_provided: HERMETICALLY SEALED AND HIGH IMPEDANCE AND W/DISABLE. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-128-9754, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.345 INCHES MINIMUM AND 0.360 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MINIMUM AND 0.075 INCHES MAXIMUM IN |
| body_length | 0.345 INCHES MINIMUM AND 0.360 INCHES MAXIMUM IN |
| bit_quantity | 1024 |
| word_quantity | 256 |
| features_provided | HERMETICALLY SEALED AND HIGH IMPEDANCE AND W/DISABLE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 12 INPUT |
| NSN | 5962-01-128-9754 |
| BIT QUANTITY | 1024 |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| WORD QUANTITY | 256 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.345 INCHES MINIMUM AND 0.360 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.075 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH IMPEDANCE AND W/DISABLE |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| MEMORY DEVICE TYPE | RAM |