351-8208-022 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

351-8208-022: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.350 INCHES NOMINAL IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.350 INCHES NOMINAL IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-270-7944, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

351-8208-022

NSN: 5962-01-270-7944
FSC: 5962 — Microcircuits, Electronic
CAGE: 13499 — ROCKWELL COLLINS, INC. DBA COLLINS AEROSPACE GOVERNMENT SYSTEMS DIV COLLINS AEROSPACE - GOVERNMENT SYSTEMS (USA)

SPECIFICATIONS

body_width	0.350 INCHES NOMINAL IN
body_height	0.100 INCHES MAXIMUM IN
body_length	0.350 INCHES NOMINAL IN
features_provided	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	HEX 1 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-270-7944

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: HEX 1 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 6 BUFFER, NONINVERTING

•

BODY WIDTH: 0.350 INCHES NOMINAL IN

•

BODY HEIGHT: 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	HEX 1 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	6 BUFFER, NONINVERTING
BODY WIDTH	0.350 INCHES NOMINAL IN
BODY HEIGHT	0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
BODY LENGTH	0.350 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

8208-022Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

Ready to buy 351-8208-022?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is 351-8208-022?

351-8208-022 is a MICROCIRCUIT,DIGITAL.

What parts can replace 351-8208-022?

There is 1 known substitute for 351-8208-022: 8208-022. Substitute compatibility should be verified for your specific system.

What is the NSN for 351-8208-022?

351-8208-022 is cataloged in the U.S. Government catalog under NSN 5962-01-270-7944. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

351-8208-022 — MICROCIRCUIT,DIGITAL

Request a Quote — 351-8208-022