351-8095-011 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

351-8095-011: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_height: 0.050 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND W/ENABLE, output_logic_form: P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, precious_material: GOLD, inclosure_material: GLASS AND METAL, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-434-3133, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

351-8095-011

NSN: 5962-00-434-3133
FSC: 5962 — Microcircuits, Electronic
CAGE: 13499 — ROCKWELL COLLINS, INC. DBA COLLINS AEROSPACE GOVERNMENT SYSTEMS DIV COLLINS AEROSPACE - GOVERNMENT SYSTEMS (USA)

SPECIFICATIONS

body_height	0.050 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND HERMETICALLY SEALED AND W/ENABLE
output_logic_form	P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
precious_material	GOLD
inclosure_material	GLASS AND METAL
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
body_outside_diameter	0.550 INCHES MAXIMUM IN
input_circuit_pattern	3 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-00-434-3133

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 3 INPUT

•

INCLOSURE MATERIAL: GLASS AND METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

PRECIOUS MATERIAL: GOLD

•

BODY OUTSIDE DIAMETER: 0.550 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.050 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND W/ENABLE

•

INCLOSURE CONFIGURATION: FLAT PACK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	3 INPUT
INCLOSURE MATERIAL	GLASS AND METAL
TERMINAL SURFACE TREATMENT	SOLDER
PRECIOUS MATERIAL	GOLD
BODY OUTSIDE DIAMETER	0.550 INCHES MAXIMUM IN
BODY HEIGHT	0.050 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND HERMETICALLY SEALED AND W/ENABLE
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 351-8095-011?

351-8095-011 is a MICROCIRCUIT,MEMORY.

What is the NSN for 351-8095-011?

351-8095-011 is cataloged in the U.S. Government catalog under NSN 5962-00-434-3133. This indicates validated use in U.S. government and defense supply chains.

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351-8095-011 — MICROCIRCUIT,MEMORY

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