351-1209-020 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

351-1209-020: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.700 INCHES MAXIMUM IN, body_height: 0.455 INCHES MAXIMUM IN, body_length: 1.262 INCHES MAXIMUM IN, special_features: WARNING: BERYLLIUM OXIDE; MISHANDLING MAY BE HAZARDOUS TO YOUR HEALTH, features_provided: HERMETICALLY SEALED AND BURN IN AND W/RESISTOR AND POSITIVE OUTPUTS, inclosure_material: METAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-243-5783, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

351-1209-020

NSN: 5962-01-243-5783
FSC: 5962 — Microcircuits, Electronic
CAGE: 13499 — ROCKWELL COLLINS, INC. DBA COLLINS AEROSPACE GOVERNMENT SYSTEMS DIV COLLINS AEROSPACE - GOVERNMENT SYSTEMS (USA)

SPECIFICATIONS

body_width	0.700 INCHES MAXIMUM IN
body_height	0.455 INCHES MAXIMUM IN
body_length	1.262 INCHES MAXIMUM IN
special_features	WARNING: BERYLLIUM OXIDE; MISHANDLING MAY BE HAZARDOUS TO YOUR HEALTH
features_provided	HERMETICALLY SEALED AND BURN IN AND W/RESISTOR AND POSITIVE OUTPUTS
inclosure_material	METAL
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	2 INPUT
inclosure_configuration	CAN
terminal_surface_treatment	SOLDER
NSN	5962-01-243-5783

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 2 INPUT

•

INCLOSURE MATERIAL: METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.700 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.455 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/RESISTOR AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: CAN

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	2 INPUT
INCLOSURE MATERIAL	METAL
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.700 INCHES MAXIMUM IN
BODY HEIGHT	0.455 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND W/RESISTOR AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	CAN
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.262 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 3

PIC-6100Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

CEAJ103Reference document

Same NSN cross-reference

Reference document — Secondary reference

SM626CReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 351-1209-020?

351-1209-020 is a MICROCIRCUIT,MEMORY.

What parts can replace 351-1209-020?

There are 3 known substitutes for 351-1209-020: PIC-6100, CEAJ103, SM626C. Substitute compatibility should be verified for your specific system.

What is the NSN for 351-1209-020?

351-1209-020 is cataloged in the U.S. Government catalog under NSN 5962-01-243-5783. This indicates validated use in U.S. government and defense supply chains.

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