The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: SCHOTTKY AND BIPOLAR AND BURN IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: PLASTIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, input_circuit_pattern: 4 INPUT, end_item_identification: A-4 ACFT. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-148-1577, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | SCHOTTKY AND BIPOLAR AND BURN IN |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | PLASTIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| input_circuit_pattern | 4 INPUT |
| end_item_identification | A-4 ACFT |
| inclosure_configuration | FLAT PACK |
| maximum_power_dissipation_rating | 794.0 MILLIWATTS |
| NSN | 5962-01-148-1577 |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| END ITEM IDENTIFICATION | A-4 ACFT |
| INCLOSURE MATERIAL | PLASTIC |
| FEATURES PROVIDED | SCHOTTKY AND BIPOLAR AND BURN IN |
| INPUT CIRCUIT PATTERN | 4 INPUT |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 794.0 MILLIWATTS |
| INCLOSURE CONFIGURATION | FLAT PACK |