349-168-016 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

349-168-016: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.606 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 1.310 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND PROGRAMMABLE AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-277-8501, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

349-168-016

NSN: 5962-01-277-8501
FSC: 5962 — Microcircuits, Electronic
CAGE: 07421 — L3HARRIS INTERSTATE ELECTRONICS CORPORATION (USA)

SPECIFICATIONS

body_width	0.606 INCHES MAXIMUM IN
body_height	0.200 INCHES MAXIMUM IN
body_length	1.310 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND PROGRAMMABLE AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-277-8501

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.606 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.200 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND PROGRAMMABLE AND BIPOLAR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.606 INCHES MAXIMUM IN
BODY HEIGHT	0.200 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.310 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

349-168-001Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 349-168-016?

349-168-016 is a MICROCIRCUIT,MEMORY.

What parts can replace 349-168-016?

There are 2 known substitutes for 349-168-016: ROM/PROM, 349-168-001. Substitute compatibility should be verified for your specific system.

What is the NSN for 349-168-016?

349-168-016 is cataloged in the U.S. Government catalog under NSN 5962-01-277-8501. This indicates validated use in U.S. government and defense supply chains.

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349-168-016 — MICROCIRCUIT,MEMORY

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