347BAND51465: SEMICONDUCTOR DEVICE ASSEMBLY.
The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include material: COPPER ALLOY 268, unit_type: PLATE, barrel_style: STRAIGHT ROUND TYPE, flange_style: FLANGE, barrel_height: 0.506 INCHES NOMINAL IN, overall_width: 1.034 INCHES NOMINAL IN. This part is cataloged in the U.S.
Government catalog under NSN 5995-00-191-0360, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY 268 |
| unit_type | PLATE |
| barrel_style | STRAIGHT ROUND TYPE |
| flange_style | FLANGE |
| barrel_height | 0.506 INCHES NOMINAL IN |
| overall_width | 1.034 INCHES NOMINAL IN |
| overall_length | 1.000 INCHES NOMINAL IN |
| overall_thickness | 0.040 INCHES NOMINAL IN |
| surface_treatment | NICKEL |
| barrel_outside_diameter | 0.173 INCHES NOMINAL IN |
| flange_outside_diameter | 0.250 INCHES NOMINAL IN |
| material_document_and_classification | QQ-B-613, COMP 1, 1/2 HARD FED SPEC SINGLE MATERIAL RESPONSE |
| NSN | 5995-00-191-0360 |