34772-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

34772-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, construction: ONE-PIECE, overall_length: 2.905 INCHES NOMINAL IN, special_features: ONE SLOT 0.188 IN. WIDE IN.

This part is cataloged in the U.S. Government catalog under NSN 5962-01-032-6839, indicating validated use in U.S. government and defense logistics supply chains.

Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

34772-1

NSN: 5962-01-032-6839
NIINs: 010326839, 013097089
FSC: 5962 — Microcircuits, Electronic
CAGE: 09344 — ROCKWELL COLLINS, INC. DBA RC DISPLAYS SYSTEMS (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MAXIMUM IN
body_length	0.840 INCHES MAXIMUM IN
construction	ONE-PIECE
overall_length	2.905 INCHES NOMINAL IN
special_features	ONE SLOT 0.188 IN. WIDE IN
features_provided	SCHOTTKY AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH IMPEDANCE AND PROGRAMMABLE AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
bolt_hole_quantity	4
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
NSN	5962-01-032-6839

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MAXIMUM IN

•

FEATURES PROVIDED: SCHOTTKY AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH IMPEDANCE AND PROGRAMMABLE AND BIPOLAR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MAXIMUM IN
FEATURES PROVIDED	SCHOTTKY AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH IMPEDANCE AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	D-2 MIL-M-38510
BODY LENGTH	0.840 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 2

HMI-7621-8Reference document

Same NSN cross-reference

Reference document — Secondary reference

M38510/20402BEBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 34772-1?

34772-1 is a MICROCIRCUIT,MEMORY.

What parts can replace 34772-1?

There are 2 known substitutes for 34772-1: HMI-7621-8, M38510/20402BEB. Substitute compatibility should be verified for your specific system.

What is the NSN for 34772-1?

34772-1 is cataloged in the U.S. Government catalog under NSN 5962-01-032-6839. This indicates validated use in U.S. government and defense supply chains.

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34772-1 — MICROCIRCUIT,MEMORY

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