Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 34772-1

34772-1 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, construction: ONE-PIECE, overall_length: 2.905 INCHES NOMINAL IN, special_features: ONE SLOT 0.188 IN. WIDE IN.

This product is currently in active production with full OEM support. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-032-6839, indicating validated use in U.S. government and defense logistics supply chains.

Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

34772-1

NSN: 5962-01-032-6839
FSC: 5962
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MAXIMUM IN
body_length	0.840 INCHES MAXIMUM IN
construction	ONE-PIECE
overall_length	2.905 INCHES NOMINAL IN
special_features	ONE SLOT 0.188 IN. WIDE IN
features_provided	SCHOTTKY AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH IMPEDANCE AND PROGRAMMABLE AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
bolt_hole_quantity	4
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
NSN	5962-01-032-6839

COMPONENT DIAGRAM

KEY FEATURES

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

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MAXIMUM POWER DISSIPATION RATING: 794.0 MILLIWATTS

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MEMORY DEVICE TYPE: ROM

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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TERMINAL SURFACE TREATMENT: SOLDER

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TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MAXIMUM POWER DISSIPATION RATING	794.0 MILLIWATTS
MEMORY DEVICE TYPE	ROM
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL SURFACE TREATMENT	SOLDER
TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TIME RATING PER CHACTERISTIC	85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
CASE OUTLINE SOURCE AND DESIGNATOR	D-2 MIL-M-38510

VERIFIED SUBSTITUTES & CROSS-REFERENCES 9

28721-00337Interchangeable