The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.600 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND LOW POWER, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-230-5045, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.600 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| body_length | 1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND LOW POWER |
| output_logic_form | METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-230-5045 |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| INCLOSURE MATERIAL | CERAMIC |
| FEATURES PROVIDED | HERMETICALLY SEALED AND LOW POWER |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY WIDTH | 0.600 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN |
| BODY LENGTH | 1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN |