3368-10-200-1107 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

3368-10-200-1107: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE AND W/CLOCK AND 3-STATE OUTPUT, inclosure_material: CERAMIC, memory_device_type: PAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-351-1802, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

3368-10-200-1107

NSN: 5962-01-351-1802
FSC: 5962 — Microcircuits, Electronic
CAGE: 25500 — LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
features_provided	PROGRAMMABLE AND W/CLOCK AND 3-STATE OUTPUT
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	18 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-351-1802

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 18 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMABLE AND W/CLOCK AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PAL

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	18 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMABLE AND W/CLOCK AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	D-10 MIL-M-38510
BODY LENGTH	1.490 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 1

5962-8670901XAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 3368-10-200-1107?

3368-10-200-1107 is a MICROCIRCUIT,MEMORY.

What parts can replace 3368-10-200-1107?

There is 1 known substitute for 3368-10-200-1107: 5962-8670901XA. Substitute compatibility should be verified for your specific system.

What is the NSN for 3368-10-200-1107?

3368-10-200-1107 is cataloged in the U.S. Government catalog under NSN 5962-01-351-1802. This indicates validated use in U.S. government and defense supply chains.

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3368-10-200-1107 — MICROCIRCUIT,MEMORY

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