335C: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: PLASTIC POLYFLUOROETHYLENE-PROPYLENE INSULATION, overall_length: 1.138 INCHES NOMINAL IN, mounting_method: THREADED STUD(S), basic_shape_style: SPIRAL SPRING, features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.190 INCHES IN. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-879-0446, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC POLYFLUOROETHYLENE-PROPYLENE INSULATION |
| overall_length | 1.138 INCHES NOMINAL IN |
| mounting_method | THREADED STUD(S) |
| basic_shape_style | SPIRAL SPRING |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.190 INCHES IN |
| thread_series_designator | UNF |
| identification_code_color | RED |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.430 INCHES NOMINAL IN |
| terminal_type_and_quantity | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| conductor_accommodation_type | SPIRAL SPRING ALL ENDS |
| NSN | 5961-00-879-0446 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 150.0 MAXIMUM REVERSE VOLTAGE, DC |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 190.0 CELSIUS JUNCTION DEGC |
| MOUNTING FACILITY QUANTITY | 1 |
| MOUNTING METHOD | THREADED STUD(S) |
| OVERALL LENGTH | 1.138 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL WIDTH ACROSS FLATS | 0.430 INCHES NOMINAL IN |
| NOMINAL THREAD SIZE | 0.190 INCHES IN |
| CURRENT RATING PER CHARACTERISTIC | 20.00 MILLIAMPERES MAXIMUM REVERSE CURRENT, DC |
| MATERIAL | SILICON SEMICONDUCTOR |