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Technical Data Sheet
333560-3 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE, terminal_surface_treatment: SOLDER. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-413-0403, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
333560-3
NSN: 5962-01-413-0403
FSC: 5962
CAGE: 80249 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. (USA)
SPECIFICATIONS
features_providedPROGRAMMED
inclosure_materialCERAMIC
memory_device_typeROM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
terminal_type_and_quantity18 PRINTED CIRCUIT
time_rating_per_chacteristic55.00 NANOSECONDS MAXIMUM DELAY NS
voltage_rating_and_type_per_characteristic7.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-413-0403
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 333560-3 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
INCLOSURE MATERIAL: CERAMIC
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
MEMORY DEVICE TYPE: ROM
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT: SOLDER
TIME RATING PER CHACTERISTIC: 55.00 NANOSECONDS MAXIMUM DELAY NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE MATERIALCERAMIC
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
MEMORY DEVICE TYPEROM
TERMINAL TYPE AND QUANTITY18 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENTSOLDER
TIME RATING PER CHACTERISTIC55.00 NANOSECONDS MAXIMUM DELAY NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
FEATURES PROVIDEDPROGRAMMED
VERIFIED SUBSTITUTES & CROSS-REFERENCES 18
MIL-M-38510/209Interchangeable
interchangeable cross-reference
interchangeable
5962-3820910BVAInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 119Interchangeable
interchangeable cross-reference
interchangeable
M38510/20910BVAInterchangeable
interchangeable cross-reference
interchangeable
722922-52Interchangeable
interchangeable cross-reference
interchangeable
49863-1Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 333560-3?
333560-3 is a MICROCIRCUIT,MEMORY.
What parts can replace 333560-3?
There are 18 known substitutes for 333560-3: MIL-M-38510/209, 5962-3820910BVA, ROM/PROM HEAD 119 and 15 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 333560-3?
333560-3 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-413-0403. This indicates validated use in U.S. government and defense supply chains.
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