3322896: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_length: 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, features_provided: BURN IN, MIL-STD-883, CLASS B AND MONOLITHIC AND HIGH IMPEDANCE, inclosure_material: SILICON, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, body_outside_diameter: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN, special_test_features: TESTED PER BENDIX DWG 3322896. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-178-2739, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_length | 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| features_provided | BURN IN, MIL-STD-883, CLASS B AND MONOLITHIC AND HIGH IMPEDANCE |
| inclosure_material | SILICON |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| special_test_features | TESTED PER BENDIX DWG 3322896 |
| inclosure_configuration | CAN |
| terminal_surface_treatment | TIN OR SOLDER |
| design_function_and_quantity | 1 AMPLIFIER, OPERATIONAL, HIGH SPEED |
| NSN | 5962-01-178-2739 |
| INCLOSURE MATERIAL | SILICON |
| TERMINAL SURFACE TREATMENT | TIN OR SOLDER |
| SPECIAL TEST FEATURES | TESTED PER BENDIX DWG 3322896 |
| BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, HIGH SPEED |
| FEATURES PROVIDED | BURN IN, MIL-STD-883, CLASS B AND MONOLITHIC AND HIGH IMPEDANCE |
| INCLOSURE CONFIGURATION | CAN |
| BODY LENGTH | 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.