3314112 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

3314112: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/OPEN COLLECTOR AND HIGH VOLTAGE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-011-2600, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

3314112

NSN: 5962-00-011-2600
FSC: 5962 — Microcircuits, Electronic
CAGE: 77068 — ALLIED-SIGNAL INC DBA ALLIED-SIGNAL AEROSPACE CO ELECTRODYNAMICS DIV (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length	0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/OPEN COLLECTOR AND HIGH VOLTAGE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	HEX 1 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
design_function_and_quantity	6 BUFFER, INVERTING AND 6 DRIVER, INVERTING
NSN	5962-00-011-2600

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: HEX 1 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 6 BUFFER, INVERTING AND 6 DRIVER, INVERTING

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/OPEN COLLECTOR AND HIGH VOLTAGE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	HEX 1 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	6 BUFFER, INVERTING AND 6 DRIVER, INVERTING
BODY WIDTH	0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/OPEN COLLECTOR AND HIGH VOLTAGE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CASE OUTLINE SOURCE AND DESIGNATOR	T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
BODY LENGTH	0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 6

DM5406JReference document

Same NSN cross-reference

Reference document — Secondary reference

Q67000-H541-Z9Reference document

Same NSN cross-reference

Reference document — Secondary reference

542-245-002Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

S5406FReference document

Same NSN cross-reference

Reference document — Secondary reference

DM5406JAReference document

Same NSN cross-reference

Reference document — Secondary reference

10186073Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 3314112?

3314112 is a MICROCIRCUIT,DIGITAL.

What parts can replace 3314112?

There are 6 known substitutes for 3314112: DM5406J, Q67000-H541-Z9, 542-245-002 and 3 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 3314112?

3314112 is cataloged in the U.S. Government catalog under NSN 5962-00-011-2600. This indicates validated use in U.S. government and defense supply chains.

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