Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 331233-13

331233-13 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.210 INCHES NOMINAL IN, body_length: 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-185-9615, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

331233-13

NSN: 5962-01-185-9615
FSC: 5962
CAGE: 80249 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.210 INCHES NOMINAL IN
body_length	1.290 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
end_item_identification	RADAR SYSTEM AN/FPS-117
NSN	5962-01-185-9615

COMPONENT DIAGRAM

KEY FEATURES

•

BODY LENGTH: 1.290 INCHES MAXIMUM IN

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BODY HEIGHT: 0.210 INCHES NOMINAL IN

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STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

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TIME RATING PER CHACTERISTIC: 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

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MEMORY DEVICE TYPE: ROM

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MEMORY CAPACITY: UNKNOWN

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TERMINAL SURFACE TREATMENT: SOLDER

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY LENGTH	1.290 INCHES MAXIMUM IN
BODY HEIGHT	0.210 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
TIME RATING PER CHACTERISTIC	100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
MEMORY DEVICE TYPE	ROM
MEMORY CAPACITY	UNKNOWN
TERMINAL SURFACE TREATMENT	SOLDER
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT
CASE OUTLINE SOURCE AND DESIGNATOR	D-3 MIL-M-38510

VERIFIED SUBSTITUTES & CROSS-REFERENCES 10

4TCInterchangeable