3273253 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

3273253: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: STEEL, overall_length: 0.917 INCHES MINIMUM AND 0.927 INCHES MAXIMUM IN, overall_diameter: 1.330 INCHES MINIMUM AND 1.358 INCHES MAXIMUM IN, special_features: MINIUM SHEAR STRENGTH,27,450 LBS,MINIMUM FIT-UP TENSILE STRENGTH,260 LBS LBS, features_provided: PROGRAMMED, surface_treatment: ZINC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-179-1749, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

3273253

NSN: 5962-01-179-1749
NIINs: 011791749, 015220725
FSC: 5962 — Microcircuits, Electronic
CAGE: 26916 — NORTHROP GRUMMAN SYSTEMS CORPORATION DBA NORTHROP GRUMMAN SYSTEMS CORP DIV MULTIPLE (USA)

SPECIFICATIONS

material	STEEL
overall_length	0.917 INCHES MINIMUM AND 0.927 INCHES MAXIMUM IN
overall_diameter	1.330 INCHES MINIMUM AND 1.358 INCHES MAXIMUM IN
special_features	MINIUM SHEAR STRENGTH,27,450 LBS,MINIMUM FIT-UP TENSILE STRENGTH,260 LBS LBS
features_provided	PROGRAMMED
surface_treatment	ZINC
memory_device_type	PAL
end_item_identification	OSHKOSH MMT DS1738 UK WHEELED TANKER TRACTOR; MRAP - M-ATV UI
inclosure_configuration	DUAL-IN-LINE
part_name_assigned_by_controlling_agency	HUCK SPIN,FLANGE HEAD COLLAR .62
NSN	5962-01-179-1749

COMPONENT DIAGRAM

KEY FEATURES

•

FEATURES PROVIDED: PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PAL

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

FEATURES PROVIDED	PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PAL

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

Ready to buy 3273253?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is 3273253?

3273253 is a MICROCIRCUIT,MEMORY.

What parts can replace 3273253?

There is 1 known substitute for 3273253: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 3273253?

3273253 is cataloged in the U.S. Government catalog under NSN 5962-01-179-1749. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

3273253 — MICROCIRCUIT,MEMORY

Request a Quote — 3273253