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327130-1 — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

327130-1: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include cushion: NOT INCLUDED, material: ALUMINUM LOCATION NOT OTHERWISE SPECIFIED, body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, mounting_pad: NOT INCLUDED. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-339-1702, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
327130-1
NSN: 5962-01-339-1702
NIINs: 013391702, 014973157
FSC: 5962 — Microcircuits, Electronic
CAGE: 88818 — KEARFOTT CORPORATION DIV GUIDANCE AND NAVIGATION DIVISION (USA)
SPECIFICATIONS
cushionNOT INCLUDED
materialALUMINUM LOCATION NOT OTHERWISE SPECIFIED
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
mounting_padNOT INCLUDED
overall_width2.000 INCHES NOMINAL IN
overall_height0.325 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
overall_length3.789 INCHES NOMINAL IN
style_designatorCURVED ARCH
features_providedBIPOLAR AND MONOLITHIC AND HERMETICALLY SEALED AND BURN IN
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
NSN5962-01-339-1702
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 327130-1 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 10 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: BIPOLAR AND MONOLITHIC AND HERMETICALLY SEALED AND BURN IN
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT0.325 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN10 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDBIPOLAR AND MONOLITHIC AND HERMETICALLY SEALED AND BURN IN
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC180.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPEPROGRAMMED
SUBSTITUTES & CROSS-REFERENCES 3
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-3850404BRAReference document
Same NSN cross-reference
Reference document — Secondary reference
M38510/50404BRAReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 327130-1?
327130-1 is a MICROCIRCUIT,DIGITAL.
What parts can replace 327130-1?
There are 3 known substitutes for 327130-1: ROM/PROM, 5962-3850404BRA, M38510/50404BRA. Substitute compatibility should be verified for your specific system.
What is the NSN for 327130-1?
327130-1 is cataloged in the U.S. Government catalog under NSN 5962-01-339-1702. This indicates validated use in U.S. government and defense supply chains.
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