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Technical Data Sheet
3262013-2 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE, terminal_surface_treatment: SOLDER, terminal_type_and_quantity: 28 PRINTED CIRCUIT, time_rating_per_chacteristic: 250.00 NANOSECONDS MAXIMUM ACCESS NS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-419-5006, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
3262013-2
NSN: 5962-01-419-5006
FSC: 5962
CAGE: 10236 — ELECTRODYNAMICS INC DIV L3HARRIS ELECTRODYNAMICS INC (USA)
SPECIFICATIONS
memory_device_typeROM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
terminal_type_and_quantity28 PRINTED CIRCUIT
time_rating_per_chacteristic250.00 NANOSECONDS MAXIMUM ACCESS NS
part_name_assigned_by_controlling_agencyPROGRAMMED 32K X 8 EPROM
voltage_rating_and_type_per_characteristic5.5 VOLTS NOMINAL POWER SOURCE
NSN5962-01-419-5006
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 3262013-2 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM ACCESS NS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.5 VOLTS NOMINAL POWER SOURCE
TIME RATING PER CHACTERISTIC250.00 NANOSECONDS MAXIMUM ACCESS NS
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT
MEMORY DEVICE TYPEROM
PART NAME ASSIGNED BY CONTROLLING AGENCYPROGRAMMED 32K X 8 EPROM
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
10328209Interchangeable
interchangeable cross-reference
interchangeable
AM27C256-250/BXAInterchangeable
interchangeable cross-reference
interchangeable
SM27C256-25JMInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 127Interchangeable
interchangeable cross-reference
interchangeable
5962-8606302XAInterchangeable
interchangeable cross-reference
interchangeable
312A5263P3Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 3262013-2?
3262013-2 is a MICROCIRCUIT,MEMORY.
What parts can replace 3262013-2?
There are 16 known substitutes for 3262013-2: 10328209, AM27C256-250/BXA, SM27C256-25JM and 13 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 3262013-2?
3262013-2 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-419-5006. This indicates validated use in U.S. government and defense supply chains.
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