Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 3261067-1

3261067-1 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN, overall_height: 0.355 INCHES NOMINAL IN, memory_capacity: UNKNOWN, features_provided: ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND W/ENABLE. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-303-6001, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

3261067-1

NSN: 5962-01-303-6001
FSC: 5962
CAGE: 10236 — ELECTRODYNAMICS INC DIV L3HARRIS ELECTRODYNAMICS INC (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
body_length	1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN
overall_height	0.355 INCHES NOMINAL IN
memory_capacity	UNKNOWN
features_provided	ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND W/ENABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-303-6001

COMPONENT DIAGRAM

KEY FEATURES

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OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC

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OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

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TERMINAL SURFACE TREATMENT: SOLDER

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MEMORY DEVICE TYPE: ROM

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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MEMORY CAPACITY: UNKNOWN

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TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 6.5 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY DEVICE TYPE	ROM
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY CAPACITY	UNKNOWN
TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	6.5 VOLTS MAXIMUM POWER SOURCE
INCLOSURE MATERIAL	CERAMIC
BODY WIDTH	0.500 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 7

7100601-1Interchangeable