325ML905: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.265 INCHES NOMINAL IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.870 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/RESISTOR, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-272-8229, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.265 INCHES NOMINAL IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 0.870 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/RESISTOR |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 125.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| design_function_and_quantity | 4 GATE, NAND |
| NSN | 5962-01-272-8229 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND |
| BODY WIDTH | 0.265 INCHES NOMINAL IN |
| BODY HEIGHT | 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/RESISTOR |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 0.870 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 125.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |