3256981-01 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

3256981-01: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.482 INCHES MAXIMUM IN, body_height: 0.290 INCHES MAXIMUM IN, body_length: 1.555 INCHES MAXIMUM IN, output_logic_form: CORE TRANSISTOR LOGIC, precious_material: GOLD, inclosure_material: CERAMIC OR METAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-221-8601, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

3256981-01

NSN: 5962-01-221-8601
FSC: 5962 — Microcircuits, Electronic
CAGE: 09150 — AMPEX DATA SYSTEMS CORP COMPUTER PRODUCTS DIV (USA)

SPECIFICATIONS

body_width	0.482 INCHES MAXIMUM IN
body_height	0.290 INCHES MAXIMUM IN
body_length	1.555 INCHES MAXIMUM IN
output_logic_form	CORE TRANSISTOR LOGIC
precious_material	GOLD
inclosure_material	CERAMIC OR METAL
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	24 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-221-8601

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 24 INPUT

•

INCLOSURE MATERIAL: CERAMIC OR METAL

•

TERMINAL SURFACE TREATMENT: GOLD

•

PRECIOUS MATERIAL: GOLD

•

BODY WIDTH: 0.482 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.290 INCHES MAXIMUM IN

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	24 INPUT
INCLOSURE MATERIAL	CERAMIC OR METAL
TERMINAL SURFACE TREATMENT	GOLD
PRECIOUS MATERIAL	GOLD
BODY WIDTH	0.482 INCHES MAXIMUM IN
BODY HEIGHT	0.290 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.555 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 3256981-01?

3256981-01 is a MICROCIRCUIT,MEMORY.

What parts can replace 3256981-01?

There is 1 known substitute for 3256981-01: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 3256981-01?

3256981-01 is cataloged in the U.S. Government catalog under NSN 5962-01-221-8601. This indicates validated use in U.S. government and defense supply chains.

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3256981-01 — MICROCIRCUIT,MEMORY

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