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3255393-120 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

3255393-120: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.080 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN, body_length: 1.380 INCHES MINIMUM AND 1.420 INCHES MAXIMUM IN, features_provided: HIGH SPEED AND BIDIRECTIONAL AND HIGH PRECISION, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-295-2918, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
3255393-120
NSN: 5962-01-295-2918
FSC: 5962 — Microcircuits, Electronic
CAGE: 53711 — NAVAL SEA SYSTEMS COMMAND (USA)
SPECIFICATIONS
body_width0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height0.080 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN
body_length1.380 INCHES MINIMUM AND 1.420 INCHES MAXIMUM IN
features_providedHIGH SPEED AND BIDIRECTIONAL AND HIGH PRECISION
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeFIRST-IN FIRST-OUT
storage_temp_range-65.0 TO 155.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-295-2918
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 3255393-120 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.080 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HIGH SPEED AND BIDIRECTIONAL AND HIGH PRECISION
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: FIRST-IN FIRST-OUT
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN14 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.560 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT0.080 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN
FEATURES PROVIDEDHIGH SPEED AND BIDIRECTIONAL AND HIGH PRECISION
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEFIRST-IN FIRST-OUT
BODY LENGTH1.380 INCHES MINIMUM AND 1.420 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 155.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 3
IDT7201S50DBReference document
Same NSN cross-reference
Reference document — Secondary reference
PC74814-1Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
IDT7201SA50DBReference document
Same NSN cross-reference
Reference document — Design control — primary reference
LIFECYCLE
NSN statusCancelled· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 3255393-120?
3255393-120 is a MICROCIRCUIT,MEMORY.
What parts can replace 3255393-120?
There are 3 known substitutes for 3255393-120: IDT7201S50DB, PC74814-1, IDT7201SA50DB. Substitute compatibility should be verified for your specific system.
What is the NSN for 3255393-120?
3255393-120 is cataloged in the U.S. Government catalog under NSN 5962-01-295-2918. This indicates validated use in U.S. government and defense supply chains.
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