The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include material: STEEL OVERALL, overall_length: 0.906 INCHES NOMINAL IN, first_end_style: CHAMFERED, hardness_rating: 60.0 ROCKWELL C MINIMUM OVERALL, mounting_method: PANEL, overall_diameter: 0.468 INCHES NOMINAL IN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 2910-00-980-2320, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | STEEL OVERALL |
| overall_length | 0.906 INCHES NOMINAL IN |
| first_end_style | CHAMFERED |
| hardness_rating | 60.0 ROCKWELL C MINIMUM OVERALL |
| mounting_method | PANEL |
| overall_diameter | 0.468 INCHES NOMINAL IN |
| second_end_style | RADIUS |
| special_features | SLEEVE, WIRE, BONE FIXATION, 1.6 MM; FOR 3.5 MM LCP PROXIMAL HUMERUS PLATE; COMPONENT OF SMALL FRAGMENT SET, NSN 6515-01-588-8442 MM |
| style_designator | ROUND FRAME, ROUND LENS TYPE |
| surface_treatment | CADMIUM AND CHROMATE OR CADMIUM OR TIN OR ZINC OR CADMIUM AND PHOSPHATE OR TIN AND CHROMATE OR ZINC AND CHROMATE OR TIN AND PHOSPHATE OR ZINC AND PHOSPHATE OVERALL |
| pin_overall_length | 2.740 INCHES MINIMUM AND 2.760 INCHES MAXIMUM IN |
| pin_overall_diameter | 0.3759 INCHES MINIMUM AND 0.3761 INCHES MAXIMUM IN |
| NSN | 2910-00-980-2320 |