320043P3: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.540 INCHES NOMINAL IN, body_height: 0.170 INCHES NOMINAL IN, body_length: 1.045 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND HIGH SPEED AND W/CLOCK AND BIPOLAR AND UNIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-154-4736, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.540 INCHES NOMINAL IN |
| body_height | 0.170 INCHES NOMINAL IN |
| body_length | 1.045 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED AND HIGH SPEED AND W/CLOCK AND BIPOLAR AND UNIPOLAR |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 11 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-154-4736 |
| INPUT CIRCUIT PATTERN | 11 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 CONVERTER, ANALOG TO DIGITAL |
| BODY WIDTH | 0.540 INCHES NOMINAL IN |
| BODY HEIGHT | 0.170 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH SPEED AND W/CLOCK AND BIPOLAR AND UNIPOLAR |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 1.045 INCHES NOMINAL IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |