32-62017-1: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: ALUMINUM ALLOY, body_width: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN, link_style: SOLID SHANK, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN, body_diameter: 0.493 INCHES MINIMUM AND 0.500 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 3040-00-955-6331, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | ALUMINUM ALLOY |
| body_width | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN |
| link_style | SOLID SHANK |
| body_height | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| body_length | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN |
| body_diameter | 0.493 INCHES MINIMUM AND 0.500 INCHES MAXIMUM IN |
| special_features | EFFECTIVE LENGTH: 8.100 INCHES IN |
| body_construction | TUBULAR |
| features_provided | PROGRAMMED AND ULTRAVIOLET ERASABLE AND W/CLOCK AND W/ENABLE AND W/DISABLE AND ASYNCHRONOUS |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| NSN | 3040-00-955-6331 |
| BODY DIAMETER | 0.493 INCHES MINIMUM AND 0.500 INCHES MAXIMUM IN |
| BODY CONSTRUCTION | TUBULAR |
| LINK STYLE | SOLID SHANK |
| MATERIAL DOCUMENT AND CLASSIFICATION | TUBING QQ-A-250/4, 2024-T3 FED SPEC SINGLE MATERIAL RESPONSE |
| END ATTACHMENT STYLE | CLEVIS NO. 1 SECOND END |
| END ATTACHMENT STYLE | EYE FIRST END |
| SPECIAL FEATURES | EFFECTIVE LENGTH: 8.100 INCHES IN |
| MATERIAL | ALUMINUM ALLOY |
No substitute or cross-reference records for this part.