Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 3191014-007-113

3191014-007-113 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.365 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, body_height: 0.090 INCHES MAXIMUM IN, body_length: 0.625 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND MONOLITHIC AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-316-1659, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

3191014-007-113

NSN: 5962-01-316-1659
FSC: 5962
CAGE: 25500 — LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.365 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
body_height	0.090 INCHES MAXIMUM IN
body_length	0.625 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND MONOLITHIC AND PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-316-1659

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS NOMINAL POWER SOURCE

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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

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STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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BODY HEIGHT: 0.090 INCHES MAXIMUM IN

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INPUT CIRCUIT PATTERN	16 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.0 VOLTS NOMINAL POWER SOURCE
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
PART NAME ASSIGNED BY CONTROLLING AGENCY	FIELD PROGRAMMING LOGIC ARRAY
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
BODY HEIGHT	0.090 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION	DUAL-IN-LINE
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER

VERIFIED SUBSTITUTES & CROSS-REFERENCES 24

CC5191-501Interchangeable