3167491: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.320 INCHES MINIMUM AND 0.468 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.190 INCHES IN, thread_series_designator: UNF. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-015-8662, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.320 INCHES MINIMUM AND 0.468 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.190 INCHES IN |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.424 INCHES MINIMUM AND 0.437 INCHES MAXIMUM IN |
| terminal_type_and_quantity | 2 TAB, SOLDER LUG |
| current_rating_per_characteristic | 125.00 MILLIAMPERES MAXIMUM REVERSE CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 50.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
| NSN | 5961-01-015-8662 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 50.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
| MOUNTING FACILITY QUANTITY | 1 |
| MOUNTING METHOD | THREADED STUD(S) |
| OVERALL LENGTH | 0.320 INCHES MINIMUM AND 0.468 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL WIDTH ACROSS FLATS | 0.424 INCHES MINIMUM AND 0.437 INCHES MAXIMUM IN |
| NOMINAL THREAD SIZE | 0.190 INCHES IN |
| CURRENT RATING PER CHARACTERISTIC | 125.00 MILLIAMPERES MAXIMUM REVERSE CURRENT, DC |
| MATERIAL | SILICON SEMICONDUCTOR |
| TERMINAL TYPE AND QUANTITY | 2 TAB, SOLDER LUG |