The INSULATING COMPOUND,ELECTRICAL is a the manufacturer industrial component. Key specifications include color: CLEAR, material: SILICONE, physical_form: PASTE, specific_usage_design: FOR HIGH STRENGTH BONDING OF SENSITIVE ELECTRONIC COMPONENTS AND SUBASSEMBLIES, supplementary_features: 10.3 OUNCE CARTRIDGE OZ, nondefinitive_spec/std_data: 2 GROUP AND 1 TYPE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 8040-01-351-9041, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| color | CLEAR |
| material | SILICONE |
| physical_form | PASTE |
| special_features | NON-SAG. PRODUCTS UNDER NSN 8040-01-351-9041 DO NOT MEET THE REQUIREMENTOF MIL-A-46146, IF REQUIRED PURCHASE NSN 5970-01-082-9128. |
| specific_usage_design | FOR HIGH STRENGTH BONDING OF SENSITIVE ELECTRONIC COMPONENTS AND SUBASSEMBLIES |
| supplementary_features | 10.3 OUNCE CARTRIDGE OZ |
| nondefinitive_spec/std_data | 2 GROUP AND 1 TYPE |
| quantity_within_each_unit_package | 10.300 OUNCES OZ |
| NSN | 8040-01-351-9041 |
| SPECIAL FEATURES | NON-SAG. PRODUCTS UNDER NSN 8040-01-351-9041 DO NOT MEET THE REQUIREMENTOF MIL-A-46146, IF REQUIRED PURCHASE NSN 5970-01-082-9128. |
| QUANTITY WITHIN EACH UNIT PACKAGE | 10.300 OUNCES OZ |
| SPECIFIC USAGE DESIGN | FOR HIGH STRENGTH BONDING OF SENSITIVE ELECTRONIC COMPONENTS AND SUBASSEMBLIES |
| SUPPLEMENTARY FEATURES | 10.3 OUNCE CARTRIDGE OZ |
| PHYSICAL FORM | PASTE |
| MATERIAL | SILICONE |
| COLOR | CLEAR |