3130-2112-02 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

3130-2112-02: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.255 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.755 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: STATIC OPERATION AND BIDIRECTIONAL AND W/ENABLE AND HIGH PERFORMANCE, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-245-9509, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

3130-2112-02

NSN: 5962-01-245-9509
FSC: 5962 — Microcircuits, Electronic
CAGE: 42161 — CXR LARUS CORPORATION DIV CXR TELCOM (USA)

SPECIFICATIONS

body_width	0.255 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	0.755 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	STATIC OPERATION AND BIDIRECTIONAL AND W/ENABLE AND HIGH PERFORMANCE
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-245-9509

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.255 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: STATIC OPERATION AND BIDIRECTIONAL AND W/ENABLE AND HIGH PERFORMANCE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.255 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	STATIC OPERATION AND BIDIRECTIONAL AND W/ENABLE AND HIGH PERFORMANCE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.755 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

AM9112DPCSame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 3130-2112-02?

3130-2112-02 is a MICROCIRCUIT,MEMORY.

What parts can replace 3130-2112-02?

There is 1 known substitute for 3130-2112-02: AM9112DPC. Substitute compatibility should be verified for your specific system.

What is the NSN for 3130-2112-02?

3130-2112-02 is cataloged in the U.S. Government catalog under NSN 5962-01-245-9509. This indicates validated use in U.S. government and defense supply chains.

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