312A5167P1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

312A5167P1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.160 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, overall_width: 0.390 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, overall_length: 1.280 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-303-0779, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

312A5167P1

NSN: 5962-01-303-0779
FSC: 5962 — Microcircuits, Electronic
CAGE: 89954 — BAE SYSTEMS CONTROLS INC. (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.160 INCHES MAXIMUM IN
body_length	1.280 INCHES MAXIMUM IN
overall_width	0.390 INCHES MAXIMUM IN
overall_height	0.400 INCHES MAXIMUM IN
overall_length	1.280 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND ULTRAVIOLET ERASABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-303-0779

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 15 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.160 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.400 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	15 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.160 INCHES MAXIMUM IN
OVERALL LENGTH	1.280 INCHES MAXIMUM IN
OVERALL WIDTH	0.390 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND ULTRAVIOLET ERASABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 167Reference document

Same NSN cross-reference

Reference document — Secondary reference

CY7C245-35WMBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 312A5167P1?

312A5167P1 is a MICROCIRCUIT,MEMORY.

What parts can replace 312A5167P1?

There are 2 known substitutes for 312A5167P1: ROM/PROM FAMILY 167, CY7C245-35WMB. Substitute compatibility should be verified for your specific system.

What is the NSN for 312A5167P1?

312A5167P1 is cataloged in the U.S. Government catalog under NSN 5962-01-303-0779. This indicates validated use in U.S. government and defense supply chains.

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